Choose the appropriate integration depth
Use an SBC for integrated standard I/O, a System-on-Module for a custom carrier, or a COTS FPGA platform for deterministic processing and high-rate data paths.
Choose between integrated boards, System-on-Modules and FPGA platforms according to custom I/O, real-time processing, software, thermal and deployment requirements.
Five product groups cover reusable compute modules, integrated boards, programmable processing platforms and configured embedded systems.
Use a compute module for processor, memory, boot and power functions while the carrier implements application-specific I/O and mechanics.
Use module-based programmable compute with high-speed memory, configuration, clocking and selected transceiver functions implemented on the module.
Use an integrated board with compute, storage, networking and common application interfaces for system-level integration.
Use standard PCIe, FMC/FMC+ and selected VPX platforms for acquisition, RF and acceleration workloads.
Evaluate workload, I/O, software, cooling and mechanics on representative hardware before defining project-specific implementation details.
The available products provides several implementation paths, from integrated boards to configurable modules and FPGA platforms. The appropriate choice depends on how much custom I/O, processing flexibility and deployment control the project requires.
Use an SBC for integrated standard I/O, a System-on-Module for a custom carrier, or a COTS FPGA platform for deterministic processing and high-rate data paths.
Processor, memory, storage, power and high-speed interfaces are available in established board or module implementations, depending on the selected platform.
Project-specific work can concentrate on field I/O, mechanics, thermal design and software rather than repeating every compute subsystem.
Platform selection can include software support, thermal requirements, mechanical constraints and component availability before the system architecture is fixed.
The platform range spans Arm System-on-Modules, FPGA and SoC-FPGA modules, single-board computers, PCIe/FMC/VPX processing boards and application-ready systems.
Mechanical format does not guarantee cross-family compatibility. Pinout revision, interface allocation, power rails, memory population and thermal interface must be checked for the selected module.
FPGA and adaptive-SoC platforms are selected around device resources, transceiver rates, DDR bandwidth, PCIe generation, FMC/FMC+ or VPX interfaces, clocking and toolchain support.
Linux, Android and RTOS availability is processor- and release-specific. Kernel, bootloader, device-tree, security and long-term maintenance requirements should be fixed with the hardware baseline.
The available products supports products where time-to-market, reusable architecture and controlled deployment matter as much as raw processor or FPGA performance.
Standardise compute across HMI, gateway, vision and control products while adapting I/O to each machine.
Accelerate gateway, telematics, logging and in-vehicle processing development with reusable networking and software foundations.
Reduce platform risk for connected instruments and imaging systems while maintaining a controlled compute and software baseline.
Bring camera acquisition, local inference and deterministic preprocessing together on scalable embedded platforms.
Use FPGA, VPX and rugged processing options to shorten development of high-rate sensor and mission-computing systems.
Move new algorithms and acquisition methods onto reconfigurable hardware without designing every supporting subsystem.